Ventec's new range of pro-bond and thermal-bond bond ply dielectrics are formulated for high-speed signal integrity with low losses and thermal management in ML PCB stack ups.

Initial range includes Resin Coated Copper (RCC) and Resin Coated Film (RCF) bondply b-stage dielectric materials. RCC bondply is an unreinforced adhesive system coated onto ultra-thin copper foil (1.5-5.0μm supported on an 18μm carrier foil) for use in high performance and high reliability multilayer PCB stack-ups. RCF bondply is an unreinforced adhesive system coated onto PET film for use in high performance and high reliability multilayer PCB stack-ups.

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