LPKF Releases New Laser
Published: 07 August 2006
GARBSEN, Germany – The LPKF ProtoLaser 100 is said to combine the capabilities of an advanced milling and drilling circuit board plotter with a sophisticated laser system.
The ProtoLaser 100 is reportedly ideal system for the laser structuring, milling and drilling of circuit carriers. A special laser system removes the copper layer between the conductive strips without affecting the substrate. Printed circuit board prototypes with 50 µm (2 mil) structures can be manufactured quickly and flexibly.
Completely integrated LPKF software automatically manages all tool parameters, as well as the interaction between laser and mechanical machining. With its operating speed and precision, the LPKF ProtoLaser 100 is said to produce excellent results on varied materials like FR4, FR3, G10, PTFE-based substrates, ceramics or Duroid.
