Xpeedic Launches EDA 2023 Suite
Xpeedic EDA 2023 Suite includes 2.5-D and 3-D signal integrity and power integrity simulation for advanced packaging, along with three platforms to support 3-D Electromagnetic simulation, multi-domain co-simulation and high-speed system simulation.
Includes the Metis 2023 SI/PI simulation platform, Hermes 2023 EM simulation platform, Notus 2023 multi-domain platform and ChannelExpert 2023 high-speed system simulation platform.
Metis 2023 SI/PI simulation platform enables easy design analysis of 2.5-D and 3-D IC packaging. Latest version introduces parameterized templates for transmission lines and interposers, allowing quick pre-simulation analysis and evaluation of die-to-die (D2D) transmission lines in the interposer. Also includes layout editing through silicon via (TSV) array channel simulation, automated perfect electrical conductor (PEC) port addition, and stacking functionalities such as chip-packaging bump and wire modeling. Also supports comprehensive PI AC analysis for rapid evaluation of power integrity in 2.5-D and 3-D IC packaging.
Hermes 2023 introduces a new quasi-static RLGC solver-based Hermes X3D, which is complementary to the full wave finite element method (FEM) solver-based Hermes Layered and Hermes 3D. With adaptive meshing and XHPC distributed simulation technologies, delivers an efficient and user-friendly simulation flow with high-precision intelligent solving capabilities.
Notus 2023 multi-domain co-simulation platform includes SI/PI co-analysis, topology extraction, and thermal analysis for chip, packaging, and board designs in high-speed design. Allows rapid analysis of signal, power, and temperature to ensure compliance with defined specifications, facilitating design iterations.
ChannelExpert 2023 offers full-link analysis for time-domain and frequency-domain analysis in high-speed systems. It provides a fast, accurate, and simple way to evaluate, analyze, and resolve high-speed channel signal integrity issues. Supports IBIS and AMI model simulation, AMI model creation, GUI-based schematic-like editing and operations, and also aids design engineers in quickly constructing high-speed channels, performing channel simulations and checking channel performance compliance with specifications.
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