tec-speed 4.0 (VT-462(L) PP NF/LF) no- and low-flow FR-4.0 prepreg material offers high-Tg, low Dk, low loss, and excellent thermal reliability.

The IPC-4101E compliant material is designed for high-reliability military, aerospace/space, and other ultra-high reliability applications. Is particularly suited for harsh environments and all flex-rigid applications with high BPS data rates, high-speed flex-rigid connectors, high-frequency & high-speed applications, satellite communications, navigation systems, and GPS.

Tg is 175°C, Td is 360°C, and Dk is 3.8, for -leading thermal performance and ease of manufacturing, allowing for better board design for applications requiring critical thermal management in the harshest environments. Glass fabric options include 1067, 1078, and 1080 with pressed thicknesses from 2.2 to 3.3 mil/ply (0.056 to 0.084 mm/ply). Is lead-free assembly compatible, fulfills RoHS and WEEE requirements, and complies with UL94 V-0.

Whether formed once to permit installation during product assembly or flexing dynamically with moving parts such as printer heads or optical drives, the material formula withstands reflow temperatures and maintains its structural integrity to prevent fatigue or corrosion.

Ventec International Group

www.venteclaminates.com

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