Condura.ultra Ag-free AMB substrate enables bonding silicon-nitride-based ceramics with copper foils.

Was developed using technique enabling high-performance Si3N4 substrates using Ag-free active metal brazing bonding technology. Designed to offer outstanding reliability and processing for sintering, bonding and soldering. Is available with standard and thick Cu layers. Thermal conductivity is ≥60 W/m.K and ≥80 W/m.K.

Heraeus Electronics
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