CircuitSeed thin, dense film is used as 3-D, finely patterned seed layers for subsequent metallization by plating.

Reduces 20-plus-step process to a few steps. Reportedly uses at least 40x less water and substantially less energy. Supports multiple chemistries that can be printed via variety of techniques as dense, finely patterned seed layers on surfaces ranging from rigid to flexible plastics and 3-D.

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