Low-temp. sintering nano-silver paste enables miniaturization and improved bending resistance of wiring for use in screen printing.

Is for smartphones and wearable devices that need bending resistance, improving transparency in window defoggers, and transparent antennas for 5G applications. Suited to printing fine wires directly onto glass of 30μm or less. When sintered at heating temp. of around 90°C, wires have resistance value below 10μΩcm. Consists of nano and submicron silver particles.

Tanaka Precious Metals
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