MacuSpec VF-TH 300 VF-TH series electroplating is for processes used in mSAP HDI manufacturing.

Is a single-step pattern plating process for simultaneous copper filling of blind microvias and plating of through-holes, while providing controlled trace profiles in mSAP applications. Deposits electrolytic copper layer naturally resistant to V-pitting, which can occur during final etching. Can use shortened bake or skip bake and achieve V-pit-free results. Process does not require pre-dip or flash plate; is analyzable by CVS. Can be plated directly onto low-etch direct metallization technologies like Blackhole LE and Eclipse LE.

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