Wonderwise 220 machine for horizontal innerlayer copper surface preparation uses Openair-Plasma.

Can prepare copper surfaces on single side or both sides automatically in PCB manufacturing. Plasma process achieves activation on copper surface for adhesion of light-sensitive films. Process enables good wettability for excellent adhesion. Footprint is 3 sq. m. Can integrate into production lines, as copper sheets can be processed directly after preparation process.

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