Printoganth RA horizontal electroless copper process was developed to ensure blister-free electroless copper deposition and shiny surface appearance after electrolytic copper plating.

Is compatible with electro-deposited copper (ED), rolled and annealed (RA) and “super-flexible RA” (HA) copper foils. Complies with different materials when plating advanced flexible and flex-rigid PCBs. Features excellent coverage on relevant base materials, including FR-4, PI and PI adhesives. Has throwing power of more than 70% into blind microvias; enables good coverage and thicker electroless copper deposits at critical spots such as blind microvia corners or on exposed adhesive layers within vias. Reportedly permits blister-free adhesion of electroless deposited copper layer, even on smooth substrates like PI.

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