Cadence Sigrity 2018 includes new 3D capabilities that enable PCB design teams to accelerate design cycles.

A 3D design and 3D analysis environment integrates tools with Cadence Allegro technology. New 3D Workbench methodology bridges gap between mechanical and electrical domains, allowing analysis of signals that cross multiple boards. Optimizes high-speed interconnect of PCBs and IC packages and automatically implements optimized PCB and IC package interconnect in Allegro PCB, Allegro Package Designer, or Allegro SiP Layout without need to redraw. Interconnect models are divided at a point where signals are more 2D in nature. By allowing 3D extraction to be performed when needed and 2D hybrid-solver extraction to be performed on the remaining structures before interconnect models are stitched back together, full end-to-end channel analysis can be performed of signals crossing multiple boards. Offers rigid-flex support for field solvers, such as Sigrity PowerSI.

Cadence
cadence.com/go/sigrity2018


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