R-1785 glass composite printed circuit board material (CEM-3 grade) improves mounting reliability of PCB parts, contributing to stability of automotive and industrial equipment.

Achieves *1 coefficient of thermal expansion (CTE). Has coefficient of thermal expansion of 15 – 17ppm/°C (α1) (board thickness: 0.8m); excellent tracking resistance compatible with miniaturization of high-current PCBs; and board thickness accuracy of ±0.05mm (board thickness: 1.6mm).

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