fastRise EZpure low-temperature curing adhesive is for rigid and flex PWBs.

Is nonreinforced, containing only a low-loss thermosettintg resin and ceramic additives. Is optimized to adhere to PTFE, polyimide, and LCP. Can be sequentially laminated and is said to have better bonding capabilities with copper than other RF prepregs. Exhibits 5 to 7 lb. of adhesion to LCP cores.

Taconic

taconic.com

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