Ansys 19.1 delivers new analysis capabilities in the electromagnetics suite for designing wireless communication, autonomous and electrification technologies.

New features include advanced driver-assistance systems and autonomous radar analysis and new hybrid simulation techniques for printed circuit board analysis. Comprehensive system modeling functionality is included with the electromagnetic field simulation products, delivering advanced analysis capability for power electronics systems. Delivers new metal additive manufacturing solutions for quickly testing product designs virtually before printing a part. Additive Suite optimizes weight reduction and lattice density; creates, repairs and cleans up CAD geometry; simulates the additive process; and conducts structural and thermal analysis for data validation. Also includes Twin Builder, which quickly and easily builds, validates and connects a digital twin to enable predictive maintenance on physical industrial assets. New 3D IC graphical user interface wizard enables automatic and seamless connections between multiple dies, interposer and package for chip-level power and thermal integrity analysis, significantly improving usability and easing 3DIC setup and analysis. Extends chip-package-system thermal solution for performing early reliability analysis, offering flexibility for system-level design, maximizing design coverage and reducing design margins and costly design iterations.

Ansys

ansys.com/19-1

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