BondFilm HF is for treatment of innerlayer cores.

Reportedly offers low signal loss required in high-frequency applications. Requires reduced surface roughening, while maintaining excellent bond strength and functional performance. Copper panels treated with it have uniform, brown organo-metallic coating. Coating retains enhanced bonding between innerlayer and prepregs used in multilayer manufacture. Is suited to high-frequency applications where signal integrity is paramount. Is drop-in replacement for existing BondFilm process users. Short process sequence is compatible with most oxide alternative lines.

Atotech
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