BondFilm LDD MSAP low-temperature pretreatment process prepares circuit board surfaces for laser direct drilling at a etch depth of 0.5µm.

Offers uniform roughness and surface characteristics for improved efficiency of laser absorption. Is made for thin material handling such as copper foils used for mSAP buildups. Suitable for use with BondFilm Horizon process equipment and non-etching post-treatment BondFilm LDD MSAP Enhancer, which prepares surfaces for subsequent process steps. Optimizes operation of mass production CO₂ lasers in an environment for mSAP applications.

Atotech

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