M-Ply prepreg is for radio frequency/digital hybrid bonding.

Comes in multiple fiberglass styles and resin contents. Is designed for multilayer RF, multifunction antennae, 5G antennae and multilayer PTFE applications. Can be used to bond PTFE to PTFE and PTFE to digital substrates. Enables combinations of RF circuitry and high-speed digital circuitry on the same circuit board. T300 of greater than 120 min. Tight thickness control. Meets NASA outgassing requirements. UL 94V-0 and 130°C MOT Rating. Meets IPC-4101/91 and /102 specifications, and is RoHS compliant. Part of Meteorwave family of materials.

Park Electrochemical / Neltec

parkelectro.com

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