NovaBond IT non-etching adhesion promoter for IC Substrates and high frequency application innerlayer bonding and soldermask pretreatment, is suited for industry-standard ABF and solder resist materials.

Exhibits bonding strength performance values on both material types. Combines benefits of non-etching surface treatment with peel strength and thermal reliability on standard ABF build-up films as well as dry film solder masks. Is directly applicable to copper surface and promotes formation of nano-dimensional copper oxide structures, promoting mechanical adhesion to bonded material.

Atotech

atotech.com