NI AWR Design Environment version 13 introduces numerous innovations in design flow management and simulation, supporting monolithic microwave integrated circuit (MMIC), RFIC, multichip module and printed circuit board technologies.

Simulation capabilities have been expanded within Microwave Office APLAC harmonic balance (HB) and Visual System Simulator(VSS) system-level simulation engines and speed improvements made to both AXIEM planar 3D and Analyst arbitrary 3D electromagnetic (EM) solvers. Design automation and simulation have been enhanced for MCMs, with greater support for multi-technology process design kits (PDKs) within a single project, new support for OpenAccess (schematic) databases and APLAC co-simulation support for Spectre RFIC netlists, as well as simplified EM layout and port creation. For PCB design, a new import wizard supports ODB++ and IPC-2851 databases to provide interoperability with mainstream third-party PCB layout tools. New layout editing capabilities have also been added, along with simplified multi-technology management. New EM Socket II architecture offers improved third-party EM simulation flows for AWR Connected partner solutions from ANSYS, CST and Sonnet, giving access to alternate EM simulators within NI AWR Design Environment. Addresses specific system requirements with accurate simulated RF front-end component measurements provided through new communication libraries for 5G candidate modulation waveforms and phased-array behavioral model enhancements.

National Instruments

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