Techni IM Gold AT6100 is for immersion gold plating. Additive makes it possible to deposit gold without nickel removal. Reportedly eliminates almost all of the replacement reaction and corrosion that occurs with a typical immersion gold process. Primary mechanism uses Ni as a site for gold reduction but does not remove it from the surface. Reaction stops once Ni is coated, creating a pore-free surface. Deposit has shown an improvement in solderability since there is no corrosion of the underlying nickel layer. Has also shown reductions in gold usage by 10 to 20% through longer bath life and tighter gold distribution.

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