This CCL is a low loss (0.007), low dielectric constant copper-clad laminate based on the Nofia FR hardener system. Demonstrates high modulus, low coefficient of thermal expansion, good peel strength, pressure cooker resistance, and a UL 94 V-0 rating for flammability. Is for smartphone and server applications.

FRX Polymers, www.frxpolymers.com
Shengyi Technology Company, www.syst.com.cn/en