Interra FL is a copper-clad no-glass laminate for rigid fine-line applications. Is a polyimide film laminated on both sides with low-profile electrodeposited copper for use in multilayer rigid circuit boards. Is suitable for HDI applications. Is compatible with standard PWB processing of thin copper clad laminates. Has a dielectric thickness of 2µm, dielectric constant of <3.5, and low loss tangent of <0.003.

DuPont, www.dupont.com