Thru-Cup MSC-PS acid cleaner is for cleaning and increased wetting of high aspect ratio plated through-holes and microvias. Reportedly has superior detergency and low surface tension that provides for electroplated copper adhesion and void-free coverage. Is designed as a drop-in replacement process for vertical copper electroplating applications. Has minimal copper etching and does not attack or damage dry film resists.

Uyemura USA, www.uyemura.com