85HP high-performance polyimide laminate and prepreg material has a Tg of 250°C. Is based on 85N polyimide resin. Uses spread glass styles and a micro-fine filler system. Reportedly offers 2x thermal conductivity vs. other polyimide resin systems. Is ideal for use in high-temperature applications such as burn-in semiconductor testing and down-hole drilling. Use of spread glass reinforcements with a filled polyimide resin system results in laminates with X-Y CTE values close to that of copper (16-18 ppm/°C) and a low Z-axis expansion.

Arlon Electronic Materials, www.arlon-med.com