Elpemer AS 2467 SM-DG solder resist has direct imaging capability and high-temperature resistance. Has short exposure times and high resolution. Withstands thermal shock tests of more than 1000 cycles at -40°/+175°C without cracking or loss of adhesion; is suitable for exposure to permanent temp. loads  >1000h up to 175°C. Can be used with Apollon 11 DI, Ledia, MDI exposure unit, Nuvogo 800, and UV-P300 direct imaging systems.

Lackwerke Peters, peters.de