T-Coin (technology of copper coin insert) structure increases the area available for heat conduction for a limited number of through-holes by inserting cylindrical copper (copper coins) into through-holes without leaving gaps, using a method that minimizes pressure loading. Is compatible with copper coin diameters between 3mm and 6mm and printed circuit board thicknesses between 1mm and 2mm. A copper coin insertion apparatus reportedly ensures uniform pressure when inserting copper coins into through-holes. Reportedly achieves a 20-fold improvement in heat dissipation.

OKI Circuit Technology, www.oki.com