Understanding PCB Design Variables that Contribute to Warpage during Module-Carrier Attachment
In an effort to improve attachment yield rates of a module to a carrier board, a design of experiment evaluated several PCB design variables believed to contribute to warpage during reflow. The objective was to isolate key design parameters that contribute most to the attachment problems. Shadow moiré was used to provide accurate warpage profiles of the six-up module arrays before and after top- and bottom-side assembly, and again before and after attachment to the carrier board.
by Donald Adams, Todd MacFadden, Rafael Maradiaga and Ryan Curry
Cost and Risk Reductions Using the IPC Traceability Standard
Many see traceability as a burden to the manufacturing process, and having to comply or conform to yet another process or standard is not considered a good day in the office or factory. IPC-1782 removes such headaches.
by Michael Ford