Canton, MA — April 2026 — Remtec, a leading innovator in advanced ceramic substrates and microelectronic assembly solutions, today announced that it will be attending the upcoming EEE International MTT-S Symposium 2026, taking place June 7–12, 2026, at the Thomas M. Menino Convention & Exhibition Center (MCEC) in Boston, Massachusetts.
President and CEO Brian Buyea made the announcement, emphasizing the importance of the event not only for Remtec, but for the broader RF and microwave engineering community.

“The MTT-S Symposium is one of the most important gatherings in the world for RF, microwave, and high-frequency innovation,” said Buyea. “This is where the industry comes together to exchange ideas, challenge assumptions, and push the boundaries of what’s possible. For Remtec, it’s an opportunity to engage directly with engineers and designers who are solving some of the most complex challenges in electronics today. These conversations drive innovation—and that’s exactly where we want to be.”

As part of the event, Microwave Journal will conduct an on-site interview with Buyea at their booth, where he will share insights into the evolving role of ceramic substrates, power electronics, and high-frequency materials in next-generation system design.

About the EEE International MTT-S Symposium

The EEE International MTT-S Symposium is widely regarded as the premier global event for microwave theory and techniques, bringing together thousands of engineers, researchers, and industry leaders from around the world. The event features cutting-edge technical sessions, product exhibitions, panel discussions, and networking opportunities focused on RF, microwave, millimeter-wave, and advanced electronic systems.

Held in Boston—one of the world’s leading hubs for technology and innovation—the symposium provides a unique platform for collaboration, learning, and showcasing the latest advancements shaping the future of high-frequency electronics.

About Remtec

Remtec is a leading provider of advanced ceramic substrate and assembly solutions for high-performance electronic applications. With over 35 years of experience, the company specializes in Alumina and Aluminum Nitride ceramic technologies, delivering superior thermal management, reliability, and electrical performance for demanding environments.
At the core of Remtec’s capabilities is its proprietary PCTF® (Plated Copper Thick Film) technology, enabling robust, high-performance interconnects for RF, microwave, and power electronics applications. From substrate design to full system-level assembly—including die attach, wire bonding, encapsulation, and housing integration—Remtec offers a true “From Substrate to System” approach.

Serving industries such as aerospace, defense, telecommunications, and industrial power, Remtec is committed to solving the toughest challenges in microelectronics with precision, reliability, and engineering expertise.