AUSTIN, TX – High Density Packaging User Group (HDP) is pleased to announce that Shikoku Chemicals Corporation (Shikoku) has become a member.

"Shikoku Chemicals has been developing distinctive copper surface treatment chemicals for PWBs and semiconductors by applying our unique organic synthesis technology, like OSP (Organic Solderability Preservative) and new chemical adhesion process between smooth copper and resin focus on the high frequency field. We look forward to working together with HDP members and hope to support cutting-edge technologies from around the world in various fields,” said Kazuhiko Yokoe, General Manager, Fine Chemicals Sale Dept. Sale & Marketing Division.

"I am pleased to welcome Shikoku to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in surface treatment chemicals for high performance PWBs, especially those focused on next-generation servers and networking products, will contribute significantly to several of our emerging technology projects", said Larry Marcanti, Executive Director of HDP User Group.