Irvine, California, USA – TopLine Corporation will exhibit and present at the upcoming 30th Edition of the Single Event Effects (SEE) Symposium coupled with the Military and Aerospace Programmable Logic Devices (MAPLD) Workshop August 31. The 2021 SEE/MAPLD Workshop will be held as a virtual meeting Tuesday, August 31 through Thursday, September 2, 2021. TopLine will present a paper titled: “Column Grid Array for Critical Missions” during the conference.

Topics covered will include Artificial Intelligence (AI) / Machine Learning (ML) in FPGAs/SoCs: AI / ML design considerations for reliable terrestrial, avionic, and aerospace applications; using AI for SEE mitigation; SEE evaluation of designs leveraging AI / ML. For more information, visit https://www.seemapld.org/.

In making the announcement, Martin Hart, TopLine CEO, said, “TopLine manufactures unique solutions to convert solder ball FPGA BGA components and CMOS LGA camera sensors to solder columns (CCGA) for extended life on SmallSat LEO space missions. Column Grid Arrays reduce board real estate, which lowers total payload size and weight. TopLine has supported Aerospace companies by solving difficult CTE mismatch problems using daisy chain components for data collection. We also have solutions for mitigating extreme random vibration with our series of COTS particle impact dampers (PID).” For more information about TopLine products and technology, visit www.CCGA.tv.

About TopLine

TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers. Contact TopLine Corporation, Tel (800) 776-9888; Email: This email address is being protected from spambots. You need JavaScript enabled to view it..