29 August 2019 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, is pleased to announce the addition of two new thermally conductive thin isolation foil materials to its range of Thermal Interface Materials (TIM) under its distribution agreement with EMI Thermal.

Initially for the European market, Ventec teamed up with EMI Thermal to provide a range of Thermal Interface Materials (TIM) that are a perfect complement to Ventec’s IMS material families, thermally conductive and standard laminates and prepregs for multilayer PCB’s. The range of materials distributed through Ventec, which includes double sided thermal tape, electrical insulators, natural graphite and void fillers, has now been expanded with the addition of two new UL94 V-0-recognized thin isolation/thermal conductive foil materials.

T-P INS 2 and T-P INS 3 A0/A1 are high-performance electrically insulating, thermally conductive interface materials that offer thermal conductivity of 1.8-3W/mK. Further features include high tensile strength (≥0.8-1.0) designed to prevent cut through and electrical shorts, low thermal impedance (0.16˚C in2/W), no viscosity and a thickness of 0.18-0.30mm, making them the ideal material choice for access control, computer and network & communications applications including SMPS, telecom devices, visual devices, networking products, LCD-TV, notebook PC’s, PC’s, etc. Full material specifications can be found at http://www.ventec-group.com/products/thermal-interface-material/.

To offer even greater value to customers, Ventec continues to maintain and build upon its one-stop-service solution for PCB materials to the European PCB and electronics industry, by offering a range of third party products that complement its own extensive product range, including flexible laminates (ThinFlex/Arisawa) and a full range of PCB production consumable products covering standard and specialty (Centrum & Glossback) drill materials, copper foils including ACF.

For more information about Ventec's solutions and the company's wide variety of products, please visit www.venteclaminates.com.

 

Register now for PCB West, the leading conference and exhibition for printed circuit board design! Coming Sept. 9-12 to the Santa Clara Convention Center. pcbwest.com

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article