Somerset, NJ – December 14, 2018 – Alpha Assembly Solutions announced that it will debut as MacDermid Alpha Electronics Solutions company during the 2019 IPC APEX EXPO being held January 26 – 31 at the San Diego Convention Center.  This will be the first time the two world leading brands in electronics manufacturing will be exhibiting as one company.

The integration of the two businesses was announced in October of 2018 with a formal merger planned in January of 2019. “Operating as a single business allows us to provide customers with the industry leading research, technologies and solutions of both Alpha Assembly Solutions and MacDermid Enthone Electronics Solutions,“ said Joe D’Ambrisi, Sr. Vice President.  “These expanded resources provide customers an advantage in today’s competitive manufacturing landscape in the Semiconductor, Circuitry and Assembly industries.“

At the show, the Alpha brand will be promoting its latest innovations and products for low-temperature soldering and void reduction, including the recently launched, ALPHA® OM-358 solder paste and ALPHA® Accuflux BTC-578 solder preforms, which are designed to meet the voiding requirements of today’s high reliability applications.  The MacDermid Enthone brand will be highlighting their complete suite of MacuSpec ViaFill processes, Affinity ENIG, and their industry proven electroless copper baths, M-Copper Omega and Via Dep 4550.  

For additional information about MacDermid Alpha’s latest technologies and products, please visit Booth #207 at IPC APEX, or contact us @ This email address is being protected from spambots. You need JavaScript enabled to view it.