WATERBURY, Conn, USA, September 5, 2018– MacDermid Enthone Electronics Solutions, a global electronics chemicals supplier, will present at the 3D MID Technical Conference which will take place at the Congress Centrum in Würzburg, Germany, September 25-26, 2018. The conference offers the latest in technology developments for both beginners and experts in molded electronics.

The presentation, “Electroless Copper Deposits Providing High Ductility and Adhesion for Advanced MID Application“, authored by Roger Bernards, Judy Ding, Boen Li, and Rich Retallick, will be delivered by Judy Ding on Tuesday, September 25 during Session 2a:Innovative Materials at 14:35. The presentation will cover the development of a novel electroless copper system exhibiting superior ductility and adhesion with no internal deposit stress for advanced metallization of substrates as well as a detailed examination of the ductility, stress and adhesion properties of the new electroless copper. Ms. Ding will also discuss benefits the new deposit exhibits including; greater than 12% elongation, zero internal stress, no blistering, no cracking under extreme bending tests, and excellent adhesion to various substrates.

About the International Congress Molded Interconnect Devices:  In 2018, the 13th MID Congress will once again bring together industry and research on all topics relating to Mechatronic Integrated Devices in Würzburg. The biennial congress, organized by the Research Association Mechatronic Integrated Devices 3-D MID e.V., is the world's leading event in MID technology. As a platform for the international exchange of knowledge and experience in the area of Mechatronic Integrated Devices, the MID-Congress provides an ideal framework to inform about the current state of the art, to exchange information with technology experts and MID users and to get in contact with scientists from all MID-relevant subject disciplines.

About MacDermid Enthone Electronics Solutions: MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. Visit us at: macdermidenthone.com/electronics.

For more information on our latest advances in Molded Interconnect Devices, contact Rich Retallick at This email address is being protected from spambots. You need JavaScript enabled to view it..

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