BERLIN, May 17, 2018: Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018.

As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging. The 68th ECTC will be held from May 29 to June 1, 2018, at the Sheraton San Diego Hotel and Marina in San Diego, USA. Atotech’s international experts and specialists can be found at booth 207.

On Wednesday, May 30, from 8:00 – 8:25 am, Tobias Bernhard, Scientist for desmear and metallization at Atotech Deutschland GmbH, will talk about the “In-situ stress determination of electroless copper on PCB-relevant substrates”. The presentation is part of Session I on “Flexible Electronics, Substrates for High Frequency Applications” and takes place in Room Harbor Island 1. In his presentation, Tobias Bernhard will present the stress evolution of electroless Cu during and after deposition on ABF, Polyimide and on Ni-Fe in combination with Ni-containing and Ni-free commercial available electroless Cu baths.

On Friday, June 1, from 10:50 – 11:15 am, Ralf Schmidt, Team Manager R&D for semiconductor technology at Atotech Deutschland GmbH, will present the “Optimization of electrodeposited copper for sub 5 µm L/S RDL lines by plating additives”. As part of Session 26 on “Wafer-Level Packaging Fan-In and Fan-Out Key Developments”, the presentation will be held in Room Harbor Island 2. In his presentation, Ralf Schmidt will present Atotech’s Spherolyte® Cu UF3 process, which fulfills the requirements of current fine line RDL. This high purity ECD Cu process is a three additive system designed for plating sub 5 µm Cu lines and large Cu pads while simultaneously enabling via filling.

Register now for PCB West, the largest trade show for the printed circuit and electronics industry in the Silicon Valley! Coming Sept. 11-13 to the Santa Clara Convention Center.