Waterbury, CT., August 21, 2017 – MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, will exhibit at SMTA International 2017, September 19-20 in Rosemont, IL.

SMTA International is a four day technical conference, including workshops as well as a full exhibition. MacDermid Enthone Process Specialists will be on hand to discuss the chemistries and materials we offer throughout the entire electronics supply chain. Products showcased will be the next generation Affinity ENIG 2.0 – a high reliability electroless nickel immersion gold process, the MacuSpec Via Fill portfolio of via filling acid coppers, and Systek Through Hole Fill for advanced thermal management of IC packages. These technologies are part of a suite of processing solutions that serve the electronics manufacturing supply chain at every step, from device design, through circuit board production, semiconductor metallization, component assembly, and OEM specification. Stop by MacDermid Enthone Electronics Solutions booth #1228, and our sister company, Alpha Assembly Solutions, booth #1016.

About MacDermid Enthone Electronics Solutions: MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. Visit us at: macdermidenthone.com/electronics

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