Lenthor Engineering, a California-based designer, manufacturer and assembler of flex and rigid-flex printed circuit boards, has invested in Hakuto’s Mach630NP next-gen dry film laminator from Matrix USA.

The Mach630NP was designed by Hakuto to solve yield issues stemming from the ever-growing expectations for smaller tolerances below 5 mils. Other benefits of the machine include ease of use and low-cost maintenance, as well as quick change of rollers and offline cassette loading to maximize the overall use of time.

Lenthor’s General Manager Rich Clemente said, “We are excited about this newest capital investment and continuing our commitment to automating our manufacturing processes. Hakuto laminators have an outstanding reputation for reliability in this industry. The upgrades in this newest model address many of the challenges we face working with ultra-thin materials, multiple copper profiles, film thicknesses and sub 2 mil lines and spaces. The yield increase expected along with the reduced labor and film waste should provide a quick ROI on this investment. We anticipate securing several more assets in the coming weeks utilizing ultra-thin core transport and automated loading/unloading which will continue our mission to make our new facility the model for flex and rigid flex manufacturing in North America.”

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