Stephen ChavezReal-time breakdowns cost more than you think.

Before I get into how cloud-based collaboration is transforming PCB design workflows, allow me to paint a fictional example of a scenario where cloud collaboration was not implemented in a PCB flow, leading to costly mistakes and potential damage to industry reputation. Note that this example is a collage of real-world scenarios I’ve encountered throughout my career.

Setting: XYZ Electronics, a mid-sized electronics company working on a crucial client project involving a complex PCB design for a military device.


Figure 1. Cloud-based collaboration can reduce costly revision control errors.

Day 1 – The beginning of the mess. Lead engineer Jody emails the initial PCB design file "military_device_v1.brd" to team members Sally (in New York) and Jane (in California). Each eagerly begins working on their assigned sections.

Day 3 – Version control nightmare. Sally makes significant changes to the power supply section. She emails "military_device_v1_Sally.brd" to the team. Meanwhile, Jane has already modified the original file and emailed "military_device_v1_Jane_updated.brd" to Jody. Jody is now stuck with three different versions and no clear way to merge changes.

Day 5 – The component crisis. Sally updates several component footprints in her local library. These updates aren’t shared with the team, however. Jane’s design uses outdated footprints. The team discovers this only after hours of work.

Day 7 – The email storm. Some 47 emails exchanged about design changes, and now there are 12 different file versions circulating. Subject lines include:

Day 10 – The review disaster. The client requests an urgent review of the database. Jody can’t determine which version is the most current. The team is now in mad panic and spends four hours in phone calls trying to align and consolidate changes. The worst outcome unfolds. The wrong version was accidentally sent to the client.

Day 12 – The local backup failure. (Recall Murphy’s Law: Anything that can go wrong, will go wrong.) Jane’s computer crashes, and her local changes from the past two days are lost. She forgot to save to the company server, leaving the team to redo 16 hours of work from scattered notes and vague recollections.

Day 15 – Manufacturing mayhem. Finally, the design is completed and sent to the manufacturer, but then the unexpected technical query (TQ) hits the email inboxes. It states that the data files sent over contain incompatible component footprints. Sally’s updated library never made it to the final version, requiring an unexpected design change to make the corrections. The project is delayed two weeks.

Financial impact:

Communication breakdown statistics:

Root causes of failure. At the root of the problem, the team lacked centralized file management and had inconsistent component libraries. Add in poor version control, inefficient communication channels, no real-time collaboration capability, vulnerable local storage, no standardized naming conventions and lack of concurrent design capabilities, and you have the perfect storm.

Lessons learned. Email is not a version control system, and local file storage is risky. Uncoordinated library updates create chaos and add additional risk to the project team. Manual file merging is time-consuming and error-prone. Clear naming conventions and real-time collaboration prove crucial, along with centralized data storage.

This scenario, while fictional, represents common real-world challenges faced by teams that do not use cloud collaboration tools. The cascading effects of poor file management, inconsistent versions and communication breakdowns demonstrate why modern PCB design workflows require robust cloud-based solutions.

The total cost of not having proper cloud collaboration tools in this scenario:

This example is a stark reminder of why investing in proper cloud collaboration tools and workflows isn’t a luxury; it’s a necessity in modern PCB design.

Now that we have a picture painted of how a project can unfold in a worst-case scenario in a non-cloud integration workflow, let’s explore how cloud integration-based PCB design is transforming the industry landscape.

Key Benefits of Cloud Collaboration in PCB Design

To illustrate the impact that cloud-based platforms can have on companies, here’s an example from a top player in the dash cam industry. The company was growing, with team members working from multiple remote locations, who were stuck doing everything the old-school legacy way: sending emails back and forth, making phone calls on the fly, holding random virtual meetings, sharing files in an designated hand-off location on the server that has no control over who can access the data or traceability of who changed what and when. It was a mess! You can imagine how frustrating it was to keep track of everything. Implementing a cloud-based platform was a gamechanger for team collaboration. Suddenly, everyone could work together easily and address potential concerns, issues and roadblocks on the fly in real time, no matter where they were in the world. The entire design process became smooth. Instead of waiting around for files or wondering if they were working on the latest version, everything was just there. Real-time, visible to all and ready to go.

The best part? Because they had teams in different time zones, work was basically happening 24/7. They ended up cutting their design time in half! New products started coming out way faster than before. It’s amazing what a difference the right tools can make.

Cloud Design Best Practices

Implementing and using a cloud-based tool isn’t all of it. Here are some best practices to ensure robust, yet flexible, workflows:

  1. Standardize nomenclature. Implement consistent naming conventions, establish clear file organization structures, define standard component libraries and create uniform design rules.
  2. Communicate efficiently. Set up regular virtual design reviews, document design changes and decisions, maintain clear communication channels, and establish notification systems for critical updates.
  3. Prioritize security. Implement robust access controls, regular security audits, data encryption protocols and backup strategies.
  4. Prepare for disruption. Implement offline working capabilities, backup internet connections and regular local backups of critical files.
  5. Support team learning. Provide comprehensive training and create detailed documentation as well as mentorship programs. Attend regular skill-enhancement workshops, industry conferences and webinars.

The move toward cloud-based PCB design isn’t a passing fad, it’s a gamechanger in how electronic design is performed. We’re talking more virtual teamwork, using integrated cloud tools for instant chats and project tracking and opening up to flexible remote work setups. Plus, with AI and automation stepping in to streamline things, and global teamwork bringing fresh perspectives to the table, the future of collaboration looks connected, efficient and adaptable in our ever-changing digital world.

Embracing these tech upgrades and setting up smart protocols can boost design efficiency and sidestep project overruns such as excessive engineering hours, budget, schedule and self-induced project cost increases and delays in manufacturing.

Stephen Chavez is a senior printed circuit engineer with three decades’ experience. In his current role as a senior product marketing manager with Siemens EDA, his focus is on developing methodologies that assist customers in adopting a strategy for resilience and integrating the design-to-source intelligence insights from Supplyframe into design for resilience. He is an IPC Certified Master Instructor Trainer (MIT) for PCB design, IPC CID+, and a Certified Printed Circuit Designer (CPCD). He is chairman of the Printed Circuit Engineering Association (PCEA); This email address is being protected from spambots. You need JavaScript enabled to view it..

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