Duane Benson

When space or heat constraints force your hand, here’s how to implement it.

There are many reasons you shouldn’t use via-in-pad. It’s not good practice, and those via holes act like little capillary straws and suck solder off the pad or the BGA (FIGURE 1).

Figure 1. Capillary action can pull solder from the pad into the via.

That said, there are some applications that may require – or seem to require – via-in-pad. Here are a few examples of why you might need to use via-in-pad:

If there is no choice, here are some methods to try when using via-in-pad:

Figure 2. Capped and plugged microvia.

For more information on via-in-pad, check out this video: http://scrm.it/viainpad.

Duane Benson is marketing manager at Screaming Circuits (screamingcircuits.com); This email address is being protected from spambots. You need JavaScript enabled to view it..

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