May 2014 Issue
FEATURES
COMPONENT PACKAGING
Power Electronics Packages with Embedded Components – Recent Trends and Developments
Power electronics packaging applications are in strong demand for their reliability and cost. Development work ranges from low-power converter modules, over single or multichip MOSFET or IGBT packages, to high-power applications. Recent developments toward module realization for high-power automotive applications include the screening and use of organic substrate materials for embedding and thermal management, as well as interconnection materials for die, module and heatsink assembly.
by Lars Boettcher, Stefan Karaszkiewicz, Dionysios Manessis and Andreas Ostmann
STENCIL DESIGN
Automating Stencil Design
Stencil design calculation capability is not new to electronics manufacturing, but evolving software tools have brought about much-needed sophistication to stencil design calculations and analyses, all while slicing the time it takes to perform the calculations.
by Chrys Shea
IPC APEX EXPO RECAP
Good Values in Vegas
LEDs and 03105 package styles were the main topics of conversation, but – surprisingly? – what really stood out at the annual IPC trade show was the exhibitors’ good vibes.
by Mike Buetow (photos by Rebekah Venturini)
FIRST PERSON
- CAVEAT LECTOR
At the Apex?
Mike Buetow
MONEY MATTERS
-
ROI
Lessons from the past.
Peter Bigelow -
FOCUS ON BUSINESS
Competition from unlikely places.
Joseph Fama
TECH TALK
-
DESIGNER’S NOTEBOOK
Constraint management.
John McMillan -
THE FLEXPERTS
Flex PCB routing.
Mark Finstad -
TECH TIPS
Close shaves.
Karl Seelig and Tim O’Neill
