March 2013 cover

 

FEATURES

CircuitHub
In Search of the Designer’s Holy Grail
The latest in a yearlong PCD&F series highlighting promising new enterprises in printed circuit board design looks at startup CircuitHub’s user-driven parts library.
by Mike Buetow

ESD Basics
The ‘Simple’ Problem
“Does my process generate an electrostatic charge, and if so, how much?” A simple “yes or no” answer is rare.
by The ESD Association

Apex Expo Recap
Let’s Get Small
At IPC Apex Expo this year, small was big. Benchtop was in and integration was all the rage at the annual North American trade show.
by Mike Buetow

Cover Story
Bridging Technology between Conventional 3D and TSV 3D Stacking

Two new multi-die DRAM packages have thin profiles and minimize wirebond length.
by  Belgacem Haba, Ph.D.

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