The world’s largest show for electronics packaging and circuits and assembling, aka the 43d JPCA Show, will be held at the Tokyo Big Sight June 5-7.

The following shows were held concurrently in the convention center: Large Electronics Show 2013, JIEP 2013 (Microelectronics Show), Jisso ProTech 2013 and Monotsukuri Fiesta 2013. In the past few newsletters I wrote about the slowdown in business and subsequent recession felt within the printed circuit industry in Japan during the last two years. Many Japanese manufacturers are looking for new business opportunities; the question is whether the JPCA Show can provide any new avenues for business.

Current market conditions for both consumer electronics and printed circuits in Japan remained soft for the first quarter. The Ministry of Economy, Trade and Industry (METI) reported a slight rebound for PWB shipments during March compared with the previous month. Unfortunately, volume is showing a double-digit decline comparing year over year.   On the other hand, the PWB industry in Taiwan posted double digits gains for this same period of time. This dramatic shift in business paints a hopeless picture for PWB manufacturers in Japan that are producing and making a market for the same products and technologies as their Taiwanese competitors.  The executive committees from Japanese manufacturers realize that a change is necessary to survive, and new business or product lines are necessary. They also recognize that it is not easy to find alternative business ventures using their own internal R&D departments and project planning staff. They are looking for new technologies that can generate new ideas and profits, which is the reason why many companies are sending R&D engineers and market researchers to various conventions and technical seminars. The JPCA Show is a large trade show that encompasses all products and technologies for printed circuit manufacturers.

Many manufacturers that were considered regulars at the show decided not to reserve booths this year because business is so slow. A lot of the major printed circuit manufacturers will be absent this year; however, they will be replaced by new companies. There was such an increase in booth rentals from these new companies that the floor size of the show is almost the same as last year’s. They are not traditional printed circuit manufacturers. Some are limited to the manufacturing process only, while others include R&D firms as well as universities and public institutes. They will introduce new technologies and  products for electronics. A business manager from one of these traditional material suppliers told me that his company decided to allocate less space for the traditional products and focus more on new materials and applications that are totally different from the traditional circuit board business.

Many are hoping to attract potential customers; however, it is my opinion that the staff working the booths are not ready to interact with new customers. Their displays are not very attractive because of their poor experiences in the new market, and their promotional messages are weak. There could be some good ideas, unfortunately, the delivery is not there. So, I ask all visitors that attend this year’s show to look past some of the staff’s communication and presentation skills – there may just be a good idea waiting to hatch.

Dominique K. Numakura, This email address is being protected from spambots. You need JavaScript enabled to view it.

DKN Research, www.dknresearchllc.com

DKN Research Newsletter #1314, May 26th, 2013 (English Edition)

Electronic Packaging Industry News from Japan & Asia

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Headlines of the week

(Please contact This email address is being protected from spambots. You need JavaScript enabled to view it. for further information of the news.)

1. Konika Minolta (Major camera and film supplier in Japan): Has decided the termination of the domestic manufacturing of X-ray dry film for medical use.

2. Nippon Shokubai (Specialty chemicals supplier in Japan): Has co-developed a new flexible OLED manufacturing process with new layer construction and materials. New device is stable in high humidity circumstances.

3. Kyocera SLC (Major printed circuit manufacturer in Japan): Had a grand breaking ceremony for the second plant in Kyoto. The new plant will produce FC-CSP substrates for smart phones and tablet PC.

4. DaiNippon Screen (Major equipment supplier in Japan): Has commercialized a new high resolution direct imaging system for high density circuit boards. It can generate 15 micron lines.

5. Ricoh (Major electronics company in Japan): Has developed a new inkjet printing/laser crystallization process to form thin PZT layer on silicon wafer for manufacturing of piezo devices.

6. Sumitomo Electric (Major flex circuit manufacturer in Japan): Has developed a new thin construction for flexible circuits filling via holes with conductive nano paste.

7. Sumitomo Chemical (Major chemical company in Japan): Has displayed a new glass-like encapsulation material for LED devices. It will improve heat resistance and chemical resistance remarkably.

8. UMC (Major semiconductor manufacturer in Taiwan): Has opened a new R&D center “Fab12” in Singapore for the specialty process. UMC plans to invest 110 million dollars for the first step.

9. Panasonic: Has developed the world brightest white organic EL (114 lm/W) device. It has equivalent efficiency as discrete LED components.

10. Yaskawa Electric (Major equipment manufacturer in Japan): Will roll out a new robot system with double arms for the sample handling in bio & medical laboratories.