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FEATURES

HDI Plating
New Copper Electrolytes for Blind Microvia Filling
Problems related to conductive pastes as fillers have led to the development of certain electrolytes. To achieve the required coating properties, these processes use high-leveling sulphuric acid copper electrolytes containing organic bath additives alongside copper sulphate, sulphuric acid and chloride.
by Michael Dietterle, Ph.D.

EMS Top 50
The Great Rebound of 2010
The electronics manufacturing industry will remember 2010 for many reasons: rampant component shortages (and the rise of counterfeits), the tight financial markets and tense end-market conditions. But mostly, it will be remembered for recovery.
by Mike Buetow

FIRST PERSON

• Caveat Lector
  By a whisker.
  Mike Buetow
  
  
  

MONEY MATTERS

• ROI
  Not so golden.
  Peter Bigelow

TECH TALK

• Designer's Notebook
  Those tricky RF conductors.
  Mark Forbes

• Tech Tips
  Masked.
  ACI Technologies Inc.

• Solar Technologies
  Let’s get small.
  Tom Falcon

• Technical Abstracts
  In case you missed it.