PCDM August 2007 Cover


Fine-Pitch BGAs
BGA Escape/Routing Patterns for Fine-Pitch Devices
High pin count BGAs capture significant improvements in thermal and electrical performance.
by Syed Wasif Ali

PCB Design Basics
Basic Electronics for PCB Design
To accommodate faster signal rise and fall, designers need to apply good placement and routing techniques.
by Susy Webb

Solder Mask
Solder Mask Challenges for New HDI Designs
LDI exposure holds promise to reduce or eliminate solder mask in hole issues.
by David A. Vaughan

Thermal Management
Improved Thermal Design Of PCBs Using Surface Optimization Modeling
Thermal modeling balances the tradeoffs between thermal compliance and signal integrity requirements.
by Dr. Robin Bornoff

iNemi Roadmap
Thermal Management in Advanced Microelectronics
New materials sets and design innovations are needed to handle the higher heat transfer demands of today's denser circuitry and increased clock speeds.
by Chuck Richardson

From the Field
2007 JPCA Show Technology Summary
This year it was a one-stop-show, from PCB design, to fabrication, through testing and into assembly.
by Dr. Hayao Nakahara

Conductor Modeling
Modeling Frequency-Dependent Conductor Losses in Serial Data Channel Interconnects - Parts 1 and 2
Roughness on the large conductor surfaces of a PCB can increase the interconnect loss as much as 50%.
by Yuriy Shlepnev


Our Line
Thermal crisis.
Kathy Nargi-Toth

Pricing limbonastics.
Peter Bigelow

Interconnect Strategies
PCB database viewing for SI analyses.
Dr. Abe Riazi

Positive Plating
Achieving an ENIG resistant LPI solder mask process.
Dominique Numakura

The Signal Doctor
Simulation tools provide a more accurate means to interpret what the receiver is seeing.
Dr. Eric Bogatin



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