MacuSpec AVF 700 electrolytic copper metallization process is for filling microvias in printed circuit boards.

Removes conventional process steps such as flash plate, micro etch and predip, while providing a stronger direct copper to copper bond for enhanced reliability of vias. Requires low amount of surface copper plating, with little to no post-processing thickness reduction.

MacDermid Enthone

www.electronics.macdermidenthone.com

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