NTwC (New Transport with Clamping) Electro Plater provides automatic, contact-free, horizontal transport of printed circuit boards mounted in clamping frames. Can be used for flash plating, panel plating, pattern plating, via filling, SAP and mSAP. PCBs with high aspect ratio (> 20:1) and substrates down to 25µm can be processed. Also works with boards up to 3.2mm.

Schmid Group, www.schmid-group.com

 

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