Fab News

SUZHOU, CHINA – Dongwei Technology, a supplier of vertical plating and surface treatment equipment, has announced plans to build a production base in Thailand, with an investment amount of RMB61 million ($8.6 million).

Read more: Dongwei Technology Plans Thai Production Facility

FONTENAY-AUX-ROSES, FRANCE – Icape Group has acquired 100% of the assets of Bordan Electronic Consult, a German company specializing in the design of custom-made technical parts.

Read more: Icape Group Acquires German Parts Supplier

SHENZHEN -- The board of directors of Shennan Circuits has unanimously approved a major investment to build a printed circuit board fabrication facility in Thailand.

Read more: Shennan Circuits to Build PCB Plant in Thailand

TOKYO – Japanese chip materials maker Resonac plans to set up a research and development center for advanced semiconductor packaging and materials in Silicon Valley.

Read more: Resonac Plans Chip Packaging R&D Center in US

LOD, ISRAEL – Israel Aerospace Industries has filed a patent for an integrated circuit assembly featuring a base structure with an interposer board and interfacing dies, and a cap structure with an intermediating board and a panel of active elements.

Read more: Israel Aerospace Industries Files for Integrated Circuit Assembly Patent

PETACH TIKVA, ISRAEL – Eltek reported revenue of $11.9 million for the third quarter, up 15% over last year's third quarter.

Read more: Eltek Announces 15% Increase in Q3 Revenue

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