LISLE, Ill. – Molex Incorporated has begun production at a new facility in St. Paul, Minn. Molex relocated to the new facility from the former Century Circuits operation Molex acquired in 2006. The new, expanded facility offers improved manufacturing process flow and provides more than double the production capacity for Copper Flex products. According to Molex, it has made significant investments in new equipment to ensure that the facility is both more efficient and capable of producing expanded product technologies for the future.
The new facility includes improved temperature and humidity controls that provide the capability to produce multi-layer flex products with more than 20 layers. Molex will now prototype and manufacture rigid flex assemblies at this new location.
“Molex continues to invest in its operational facilities to provide the most efficient manufacturing processes and best possible products to our customers,” said Todd Hester, general manager, printed circuit products group, Molex Incorporated. “Our new Copper Flex facility will not only increase our product output, but provide a better work environment for employees to manufacture the industry's leading product solutions.”
The location also employs new lean manufacturing processes that support progressive manufacturing techniques that will improve plant efficiency and overall product quality. The implementation of Class 10,000 clean room capabilities will also allow for future product directions for fine line flex products.
“Molex Copper Flex products meet the challenging needs of today's technology driven world and are able to replace a variety of electronic interconnects, simplifying the production process and making it more dependable,” said Gary Manchester, marketing director, Molex Incorporated. “Molex has invested in its capabilities to ensure we produce Copper Flex materials that are superior, quality products.”
ARLINGTON, VA – A copy of the working draft of J-STD-709, Definition of Maximum Limits on Bromine and Chlorine Used in Materials for Low Halogen Electronic Components and Assemblies, is available for review.
The committee will meet on Sept. 25 in Schaumburg, IL. Information on registration, venue, etc. for the meeting can be found at www.ipcmidwestshow.org.