ARLINGTON, VA – A copy of the working draft of J-STD-709, Definition of Maximum Limits on Bromine and Chlorine Used in Materials for Low Halogen Electronic Components and Assemblies, is available for review.
The committee will meet on Sept. 25 in Schaumburg, IL. Information on registration, venue, etc. for the meeting can be found at www.ipcmidwestshow.org.
TAIWAN – Taiwan-based Foxconn has unveiled its first software base in mainland China, according to a report from ChinaTechNews.com. This comes after the company signed a letter of intent with the municipal government of Nanjing earlier this year.
According to the report, CEO Terry Guo said the company chose the Pukou district of Nanjing for its facility, which will design wireless communications networks, enterprise information security and medical software.
The company plans to recruit 30,000 software engineers in five years for the Nanjing site, according to media reports. The site is now operational with more than 200 software developers.
TAIPEI, TAIWAN — Laird Technologies announced that it signed a distribution and lamination agreement with ITEQ Corp. The combined resources of ITEQ and Laird Technologies uniquely positions both companies to supply solutions to the growing LED based BLUs for LCD Flat Panel Display.
Read more: Laird Technologies and ITEQ Partner for LCD FPD
YAVNE, ISRAEL – Valor Computerized Systems announced second-quarter revenues rose 14.8% over the same quarter last year to $10.6 million. The software company’s net profit fell 32% to $681,000 for the quarter. Earnings before taxes, depreciation and other charges (EBITDA) fell 13% to $1 million.
Product revenue was up 16.5%, while maintenance revenue climbed 12%.
First-half revenues grew 18.7% year-over-year to $20.9 million. The company reported EBITA rose 19.9%, but earnings dropped 3.7% year-over-year.
ATLANTA – UP Media Group Inc., parent company of Printed Circuit Design & Manufacture, announced Joseph Fjelstad, founder and president of Verdant Enterprises, will deliver the keynote address at PCB Design Conference East 2007 in Durham, NC, on Oct. 23, at 11 a.m. in the Durham Marriott at the Civic Center.
Fjelstad’s keynote, titled "Robust Environmentally Friendly Electronics Assembly," will reveal a new electronics assembly process said to use no solder – eliminating many of the risks and reliability exposures associated with lead-free solders – and no conventional circuit boards.
The Reverse Interconnection Process embodies a new sequence of core processing technologies, and is achieved through direct copper-copper plate-up onto an inverted cast-in-place component-array platform. The process has demonstrated the conceptual potential for the manufacture of high-density, high-performance, high-reliability and environmentally (i.e., RoHS) compliant solutions for products ranging from consumer to mil-aero applications.
Founder and president of Verdant Electronics, Fjelstad has more than 35 years of experience in electronics interconnection and packaging in a variety of capacities, from chemist to process engineer and from international consultant to CEO.
The keynote is free to attend; however, registration and a badge are required for admission. To register online or find out more about the Oct. 21-26 show, visit www.pcbeast.com.
UPMG's 2008 conferences include PCB East 2008 on May 11-16 at the Holiday Inn Select & Convention Center in Tinley Park, IL, and PCB West 2008 on September 14-19 at the Marriott Santa Clara in Santa Clara, CA.