MISSISSAUGA, ON -- Advanced Copper Foil has secured an international patent for its poly-supported copper foil.

The patent is non-provisional under International Application number PCT/050938, the firm said.

The product, which ACF has branded ACF-Screen, is comprised of a proprietary protective poly release film, which is adhered to sheets of ultra-thin copper foil in a cleanroom environment. The product is said to protect the copper surface throughout the entire cycle of PCB layup and lamination. ACF-Screen utilizes an inert adhesive which results in a residue-free copper surface during subsequent processing. The release film withstands temperatures of the lamination cycle, for easy removal during break-down.

“This product is going to revolutionize the industry. It will ease the handling of copper foils compared to loose foils, resulting in more efficient and speedier layup process,” says Shane Stewart, product manager.

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