WILSONVILLE, OR -- Mentor today announced the launch of a consortium to drive new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer IC designs.

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CHELMSFORD, MA -- EMA Design Automation and Cadence will sponsor a two-hour luncheon tutorial on the newest features in the OrCAD 17.2 PCB design software next month.

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